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Heat transfer augmentation using a ribedimple compound cooling technique
| Year of publication | 2013 | ||||
| Title of paper | Heat transfer augmentation using a ribedimple compound cooling technique | ||||
| Author | Eun Yeong Choi, Yong Duck Choi, Won Suk Lee, Jin Teak Chung, Jae Su Kwak | ||||
| Publication in journal | Applied Thermal Engineering 51 | ||||
| Status of publication | published | ||||
